The laboratory is equipped with instrumentation suitable for fabrication of both flat and three-dimensional structures. The systems equipped with precise workpiece positioning and laser beam scanning allow producing structures in the micrometer scale. The broad spectrum of available laser sources spanning from UV to IR allows processing various materials including metals, semiconductors, plastics, glass and ceramics.
The use of ultra-short laser pulses and the radiation in the UV range reduces thermal effects and provides significant improvement in the quality of micromachined features.
Microdrilling, micromilling, microcutting and microperforation
Fabrication of microstructures for photovoltaics, microelectronics, microfluidics, MEMS
Scribing of silicon and sapphire wafers
Structuring of the surface
Preparation of functional surfaces (eg. hydrophobic, hydrophilic)
Selective removal of thin films
Rapid PCB prototyping
Remote chemical analysis of samples
Micromachining system with picosecond laser
- Three independent optical paths for the wavelengths of 1064, 532 and 355 nm
- Each wavelength has a dedicated scanning head
- Maximum average power: 36W @ 1064 nm, 19 W @ 532 nm, 6 W @ 355 nm
- Pulse length: 15 ps
- Minimum laser spot size: 20 μm
Micromachining systems with excimer laser
- Laser wavelength: 248 (KrF)
- Maximum average power: 80 W
- Pulse length: 12-20 ns
- Minimum laser spot size: 5 µm
Micromachining system with fiber laser and CO2 laser
- Laser wavelengths: 1062 nm (fiber laser), 10 µm (CO2 laser)
- Maximum average power: 20 W (fiber laser), 80 W (CO2 laser)
- Pulse length of fiber laser: 3-500 ns
- Each system is mounted on a stable anti-vibration granite table equipped with three or four-axis CNC system which allows movement of the workpiece with an accuracy of 1 µm. In addition, the system with the picosecond and fibre lasers has a galvanometer scanhead constituting additional two optical axes.
- Each system automatically measures the distance between focusing optics and workpiece allowing precise positioning of minimal laser spot on a sample.
- Keyence VHX-1000 digital microscope with a magnification of 20 to 5 000 times, giving the opportunity to take measurements along three axes and creating 3D images.
- Seven-channel LIBS 2500plus spectrometer for the remote analysis of the composition of the tested samples.
Tomasz Baraniecki PhD– Head of laboratory
tel: + 48-71-734-71-67
Mr. Tomasz Baraniecki studied at the Faculty of Electronics at the Wroclaw University of Technology, where he finished the specialization in the field of optoelectronics and fiber optics. Then he spent six years at the Technische Universität Braunschweig (Germany), where he received the doctor’s degree with the topic of fiber lasers. After returning to Poland he was worked in the industry for couple of years, including company Oxford Diffraction, the manufacturer of X-ray diffractometers. Then, he was employed at the Faculty of Mechanical Engineering at the Wroclaw University of Technology for over six years. He worked there on research projects concerning the use of lasers in materials processing (laser cutting, welding, cladding, micromachining). He is currently working at the Wroclaw Research Centre EIT +, where he is the head of the laser micromachining laboratory.
Paweł Kozioł – Process Engineer
Paweł Kozioł studied at the Faculty of Electronics at the Wroclaw University of Technology. Then he began his PhD studies at the some faculty. His main scientific interests include laser micromachining, metamaterials and materials science. He is a co-author of 9 publications in JCR-indexed journals, 1 national (Polish) patent, 1 international patent application and over 18 conference contributions. Since 2010 he has participated in 3 research projects devoted to laser micromachining. Currently he is employed as a process engineer in Wroclaw Research Centre EIT +.
Posted by Wrocławskie Centrum Badań EIT+, Posted on 27.01.2016